Equipment Status
| Equipment | Status | Note | Contact: |
| Atomic force microscope | Up | Mo | |
| Atomic Layer Deposition (ALD, Fiji) | Up | Sam | |
| E-beam evaporator (Denton EXPLORER) | Down | Cryopump pump down! | Mo |
| E-beam evaporator (Temescal BJD-1800) | Up | Mo | |
| E-beam lithography (Raith e-line) | Down | Sam | |
| FILMETRICS Thin Film Analyzer (F20)* | Up | Mo | |
| Four-probe sheet resistance* | Up | Mo | |
| Hall effect measurement system** | Up | ||
| Karl Suss Mask Aligner (MJB3) | Up | Mo | |
| Karl Suss Mask Aligner (MA6) | Up | Mo | |
| Karl Suss Mask Aligner (MJB4)* | Up | Mo | |
| MBraun Glovebox – (Characterization line) | Up | Mo | |
| MBraun Glovebox – (Fabrication line) | Up | Mo | |
| MOCVD (Agnitron) | Up | Sam | |
| Nanoscribe 3D Printer (GT2) | Up | Mo | |
| Etcher (NDR4000, Modes: RIE and Deep RIE) | Up | Mo | |
| Ocean optics UV-VIS spectrometer** | Up | Mo | |
| Photoconductivity** | Up | – | |
| Plasma Cleaner (Tregeo) | Up | Mo | |
| Probe Station(s)* | Up | Mo | |
| Rapid Thermal Process (RTP – Solaris 150) | Up | Sam | |
| Reactive Ion Etcher | Down | Turbo pump down! | Sam |
| Semiconductor analyzer(s)* | Up | Mo | |
| Spectrophotometer (Varian – Cary5000 UV/VIS)** | Up | Mo | |
| Sputtering (Denton, metal) | Up | Sam | |
| Sputtering (ITO) | Up | Mo | |
| sputtering (ZnO) | Up | Sam | |
| Surface profilometer (XP-100) | Up | Mo | |
| Tube Furnace (Boron)* | Up | Mo | |
| Tube Furnace (Metal Sintering)* | Up | Mo | |
| Tube Furnace (Phosphorous)* | Up | Mo | |
| Tube Furnace (Wet & Dry Oxidation)* | Up | Mo | |
| Wet Etch Bench – RCA clean* | Up | Mo | |
| Wire bonder | Up | Mo | |
Notes: Equipment belongs to *EE432 or ** EE535 course. |