| Equipment |
Status |
Note |
Contact: |
| Atomic force microscope |
Up |
|
Mo |
| Atomic Layer Deposition (ALD, Fiji) |
Up |
|
Sam |
| E-beam evaporator (Denton EXPLORER) |
Up |
|
Mo |
| E-beam evaporator (Temescal BJD-1800) |
Up |
|
Mo |
| E-beam lithography (Raith e-line) |
Down |
|
Sam |
| FILMETRICS Thin Film Analyzer (F20)* |
Up |
|
Mo |
| Four-probe sheet resistance* |
Up |
|
Mo |
| Hall effect measurement system** |
Up |
|
Prof. Dalal |
| Karl Suss Mask Aligner (MJB3) |
Up |
|
Mo |
| Karl Suss Mask Aligner (MA6) |
Up |
|
Mo |
| Karl Suss Mask Aligner (MJB4)* |
Up |
|
Mo |
| MBraun Glovebox – (Characterization line) |
Up |
|
Prof. Dalal |
| MBraun Glovebox – (Fabrication line) |
Up |
|
Prof. Dalal |
| MOCVD (Agnitron) |
Up |
|
Sam |
| Nanoscribe 3D Printer (GT2) |
Up |
|
– |
| Etcher (NDR4000, Modes: RIE and Deep RIE) |
Up |
|
Sam |
| Ocean optics UV-VIS spectrometer** |
Up |
|
Prof. Dalal |
| Photoconductivity** |
Up |
|
Prof. Dalal |
| Plasma Cleaner (Tregeo) |
Up |
|
Mo |
| Probe Station(s)* |
Up |
|
Mo |
| Rapid Thermal Process (RTP – Solaris 150) |
Up |
|
Sam |
| Reactive Ion Etcher |
Down |
|
Sam |
| Semiconductor analyzer(s)* |
Up |
|
Mo |
| Spectrophotometer (Varian – Cary5000 UV/VIS)** |
Up |
|
Prof. Dalal |
| Sputtering (Denton, metal) |
Up |
|
Sam |
| Sputtering (ITO) |
Up |
|
Prof. Dalal |
| sputtering (ZnO) |
Up |
|
Sam |
| Surface profilometer (XP-100) |
Up |
|
Prof. Meng Lu |
| Tube Furnace (Boron)* |
Up |
|
Mo |
| Tube Furnace (Metal Sintering)* |
Up |
|
Mo |
| Tube Furnace (Phosphorous)* |
Up |
|
Mo |
| Tube Furnace (Wet & Dry Oxidation)* |
Up |
|
Mo |
| Wet Etch Bench – RCA clean* |
Up |
|
Mo |
| Wire bonder |
Up |
|
Sam |
|
|
|
|
|