Karl Suss MA6 system is a semi-automated top and bottom side mask aligner used for high resolution photolithography. This tool is mainly designed for microfabrication of CYMOS as well as research and development of semiconductor technologies.
Capabilities and specifications:
- MA6 can handle up to 6″ wafers with maximum substrate thickness of 0.6 cm
- Fine lithography down to 1 micron
- Mercury lamp with two wavelength channels (i.e., 365 nm and 405 nm)
- Different wafer chucks and mask holders
- Different modes of exposure
Contact: Dr. Moneim Ismail or Dr. Liang Dong