The RF Sputtering system is a thin-film technology used for the deposition of a wide range of metal oxides. A target material is sputtered by an ion bombardment in a plasma-based process. In this process, the sputtered materials is deposited as a thin film on the substrate to be coated. The RF sputtering system is equipped with a turbo molecular pump to get low pressure (10-6 mbar). This RF Sputtering is designated to deposit thin film layers for a variety of applications (i.e., solar cells, transistors, LEDs, and sensors).
Capabilities and specifications:
- ITO target
- Sputtering area 2″ in diameter
- Argon gas supply for plasma
Contact: Dr. Qingfeng Xing or Dr. Liang Dong